Choose from a Large Selection of High-Frequency Technologies
Maxim is uniquely qualified to solve high-frequency ASIC needs with its leading-edge process technologies.
CB-2 provides high-speed complementary NPNs and vertical PNPs optimized for high-linearity cable and instrumentation
applications. GST-2, the foundation of Maxim's bipolar processes, is a highly reliable, cost-effective process
used in a wide variety of applications up to 2.4GHz. MBiC-1 supplies BiCMOS for wireless applications up to 2.4GHz.
MBiC-2 and F60 offer high-speed, double-polysilicon SiGe BiCMOS technologies featuring high-speed SiGe transistors,
metal film resistors, and high-Q inductors. GST-35, also a high-performance SiGe process, provides vertical PNPs
and JFETs optimized for both mobile and high-linearity applications. The F120 is a high-speed SiGe process ideal for
ultra-high-speed applications.
Laser Trim Available for All Wireless Designs
All Maxim high-frequency technologies feature laser trim of either NiCr or SiCr resistors. Laser trim is performed at
final wafer test. Contact Maxim to discuss your specific laser-trim needs.
RF Wireless Packaging Capabilities Expand at Maxim
Maxim is a full-service ASIC supplier providing the latest in packaging technologies for wireless applications.
Our dedicated group produces exceedingly accurate RF models for our most popular packages. This is a key element
contributing to our outstanding ASIC first-pass success.
The QFN package is an excellent RF package used extensively by our wireless group. It is a
leadless package with a heat spreader that allows downbonds to the die pad for a low-inductance
ground connection.
The UCSP™ is a flip-chip package used in many of our RF-wireless applications.
It features extremely low inductance connections to the PC board and has a very small footprint.
